Manual Expander "ME-200"
Introducing a dicing peripheral device to prevent interference during chip pickup!
The "ME-200" is a manual expander that allows the wafer, which has been diced into individual chips, to be moved to an expansion ring while maintaining the gaps between the chips to prevent interference. This is done while the wafer is still attached to the tape frame. It is ideal for research and development as it allows for easy expansion of the wafer. It can also be repurposed for expanding IC substrates and other applications. 【Features】 - The amount of wafer expansion can be adjusted arbitrarily by turning the handle. - The operating temperature can be set widely up to a maximum of 100°C. - Design modifications can be made to accommodate the tape frame and expansion ring used (optional). - It is perfect for research and development due to the ease of wafer expansion. - It can also be repurposed for expanding IC substrates and other applications. *For detailed information and product catalogs, please access the related links.
- Company:イーアールエス
- Price:Other